Silicone encapsulants and potting compounds are used to protect delicate electronic circuitry. This protection may be required for a number of reasons:-mechanical shock, thermal shock, vibration, chemical attack, humidity, extreme temperatures and wide thermal cycles, to mention a few. In addition to providing protection, the encapsulant may also be used to perform other functions, such as thermal transfer and improved light transmission.
Silicone polymers and elastomers have particular inherent physical properties including:
These natural properties can be further enhanced using fillers and chemical additives to provide additional features when needed, including flame retardancy, thermal conductivity, electrical conductivity and adhesion. Through the selection of polymers and fillers it is also possible to adjust viscosity and rheology and the final hardness and modulus of the cured rubber. Control of the curing regime and speed can be achieved using the silicone chemistry to produce both heat and room temperature cure systems. Silicones can be supplied as 1 or 2-part systems. In short, silicone encapsulants are very versatile and provide design engineers with a wide product choice.
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